The Institute for Interconnecting and Packaging Electronic Circuits Number 2215 Sanders Road · Northbrook, IL 60062-6135 2.4.1.3 Subject IPC Adhesion, Resistors (Hybrid Circuits) Date Revision 12/87 IPC-TM-650 Originating Task Group TEST METHODS MANUAL N/A 1.0Scope This test method is to determine the adhesion quality of resistive and capacitive materials on the substrate surface of finished hybrid circuits. 2.0 Applicable Documents General Service Administra tion approved Commercial Item Description (CID) Standard AA113B, "Tape Pressure Sensitive Adhesive", FSC 7510- 551-982. 3.0 Test Specimen 3.1Any finished hybrid circuit having the resistor under test applied to its surface. A minimum of three tests should be performed for each evaluation. 4.0 Apparatus 4.1 Tape e12.7 mm [1/2 inch] wide roll pressure sensitive tape (3m brand 600 transparent tape or equivalent per CID - AA113B Type 1; Class B) 5.0 Procedure 5.1 Test 5.1.1 Press a strip of pressure sensitive tape 12.7 mm [1/2 inch] wide and 2 inches long firmly across the surface of the board covering marking on both the laminate and metal con- ductors. 5.1.2 Rapidly move the tape by manual force applied face. Fresh tape must be used each time. 5.2Evaluation 5.2.1 Visually examine the tape and specimen for evidence of any portion of the resistor having come off the surface of ing to the tape. 6.0 Note 6.1 Failure of the resistive material to properly adhere to the ceramic substrate constitutes failure of the test. Material inthis Test Methods Manual was voluntarly established by Technical Commitees ofthe IPC.This material is advisoryonly and its use or adaptation is entirely voluntary. IPC disclaims all liability of any kind as to the use, application, or adaptation of this Page 1 of 1 material. Users are also wholly responsible for protecting themselves against all claims or liabilties for patent infringement. Equipment referenced is for the convenience of the user and does not imply endorsement by the IPC. The Institute for Interconnecting and Packaging Electronic Circuits Number 2215 Sanders Road · Northbrook, IL 60062-6135 2.4.1.3 Subject IPC Adhesion, Resistors (Hybrid Circuits) Date Revision 12/87 IPC-TM-650 Originating Task Group TEST METHODS MANUAL N/A 1.0Scope This test method is to determine the adhesion quality of resistive and capacitive materials on the substrate surface of finished hybrid circuits. 2.0 Applicable Documents General Service Administra tion approved Commercial Item Description (CID) Standard AA113B, "Tape Pressure Sensitive Adhesive", FSC 7510- 551-982. 3.0 Test Specimen 3.1Any finished hybrid circuit having the resistor under test applied to its surface. A minimum of three tests should be performed for each evaluation. 4.0 Apparatus 4.1 Tape e12.7 mm [1/2 inch] wide roll pressure sensitive tape (3m brand 600 transparent tape or equivalent per CID - AA113B Type 1; Class B) 5.0 Procedure 5.1 Test 5.1.1 Press a strip of pressure sensitive tape 12.7 mm [1/2 inch] wide and 2 inches long firmly across the surface of the board covering marking on both the laminate and metal con- ductors. 5.1.2 Rapidly move the tape by manual force applied face. Fresh tape must be used each time. 5.2Evaluation 5.2.1 Visually examine the tape and specimen for evidence of any portion of the resistor having come off the surface of ing to the tape. 6.0 Note 6.1 Failure of the resistive material to properly adhere to the ceramic substrate constitutes failure of the test. Material inthis Test Methods Manual was voluntarly established by Technical Commitees ofthe IPC.This material is advisoryonly and its use or adaptation is entirely voluntary. IPC disclaims all liability of any kind as to the use, application, or adaptation of this Page 1 of 1 material. Users are also wholly responsible for protecting themselves against all claims or liabilties for patent infringement. Equipment referenced is for the convenience of the user and does not imply endorsement by the IPC. The Inst