IPC-TM-650 2018-May IPC Test Method Manual A standard developed by IPC Association Connecting Electronics Industries CIPC 英文版是2018年刚刚整理发行的最新版本，全文共计700多页，升级 了较多的文件内容，同时，也取消并删除了很多章节。 中文版官方未正式发行，只是个别几个章节有翻译成中文。第三方发 行的也较早，也只有书本扫描件，很多和最新的英文版章节对不上， 只能做为参考资料。建议使用英文原版。 更多IPC文件参考：Www.file123.top Test Methods Approved SECTION 1.0 - 1.0 Reporting and Measurement Analysis Methods TM 1.1C Introduction 1/03 TM 1.2A Calibration 1/03 TM 1.3A Ambient Conditions 1/03 TM 1.4A Reporting, General 1/03 TM 1.5A Reporting, Format 1/03 TM 1.6A Numerical Reporting 1/03 TM 1.7A Reporting, Invalid Test Results 1/03 TM 1.8A Measurement Precision Estimation for Binary Data 1/03 Includes Calculator and User Guide TM 1.9A Measurement Precision Estimation for Variables Data 1/03 Includes Calculator and User Guide SECTION 2.1 - 2.1 Visual Test Methods TM 2.1.1F Microsectioning, Manual and Semi or Automatic 6/15 TM 2.1.2A Pinhole Evaluation, Dye Penetration Method 3/76 TM 2.1.3A Plated-Through Hole Structure Evaluation 8/76 TM 2.1.5A Surface Examination, Unclad and Metal-Clad Material 12/82 TM 2.1.6B Thickness of Glass Fabric 12/94 TM 2.1.6.1 Weight of Fabric Reinforcements 12/94 renumbered from 2.3.12 TM 2.1.7C Thread Count of Glass Fabric 12/94 TM 2.1.7.1 Thread Count, Organic Fibers 12/87 TM 2.1.8B Workmanship 12/94 TM 2.1.9 Surface Scratch Examination Metal-Clad Foil 5/86 TM 2.1.10A Visual Inspection for Undissolved Dicyandiamide 12/94 TM 2.1.13B Inspection for Voids in Flexible Printed Board Materials 5/12 SECTION 2.2 - 2.2 Dimensional Test Methods TM 2.2.1A Mechanical Dimensional Verification 8/97 TM 2.2.2B Optical Dimensional Verification 8/97 TM 2.2.4C Dimensional Stability, Flexible Dielectric Materials 5/98 TM 2.2.5A Dimensional Inspections Using Microsections 8/97 TM 2.2.6A Hole Size Measurement, Drilled 8/97 TM 2.2.7A Hole Size Measurement, Plated 5/86 TM 2.2.12A Thickness of Copper by Weight 3/76 TM 2.2.12.1 Overall Thickness and Profile Factor of Copper Foils Treated and Untreated 9/87 TM 2.2.12.2 Weight and Thickness of Copper Foils with Releasable Carriers 7/89 TM 2.2.12.3 Weight and Thickness Determination of Copper Foils With Etchable Carriers 7/89 TM 2.2.13.1A Thickness, Plating in Holes, Microhm Method 1/83 TM 2.2.14 Solder Powder Particle Size Distribution - Screen Method for Types 1-4 1/95 TM 2.2.14.1 Solder Powder Particle Size Distribution - Measuring Microscope Method 1/95 TM 2.2.14.2 Solder Powder Particle Size Distribution - Optical Image Analyzer Method 1/95 TM 2.2.14.3 Determination of Maximum Solder Powder Particle Size 1/95 TM 2.2.17A Surface Roughness and Profile of Metallic Foils (Contacting Stylus Technique) 2/01 TM 2.2.18 Determination of Thickness of Laminates by Mechanical Measurement 12/94 TM 2.2.18.1 Determination of Thickness of Metallic Clad Laminates, Cross- sectional 12/94 TM 2.2.19.1 Length, Width and Perpendicularity of Laminate and Prepreg Panels 12/94 TM 2.2.20 Solder Paste Metal Content by Weight 1/95 TM 2.2.21 Planarity of Dielectrics for High Density Interconnection (HDI)/Microvia Technology 11/98 SECTION 2.3 - 2.3 Chemical Test Methods TM 2.3.1 Chemical Processing, Suitable Processing Material 4/73 TM 2.3.1.1B Chemical Cleaning of Metal-Clad Laminate 5/86 TM 2.3.2G Chemical Resistance of Flexible Printed Board Materials 12/07 TM 2.3.4B Chemical Resistance, Marking Paints and Inks 8/87 TM 2.3.4.2A Chemical Resistance of Laminates, Prepreg, and Coated Foil Products, by Solvent Exposure 12/94 TM 2.3.4.3 Chemical Resistance of Core Materials to Methylene Chloride 5/86 TM 2.3.6A Etching Ammonium Persulfate Method 7/75 TM 2.3.7A Etching, Ferric Chloride Method 7/75 TM 2.3.7.1A Cupric Chloride Etching Method 12/94 TM 2.3.7.2A Alkaline Etching Method 12/94 TM 2.3.9D Flammability of Prepreg and Thin Laminate 8/97 TM 2.3.10B Flammability of Laminate 12/94 TM 2.3.10.1 Flammability of Soldermask on Printed Wiring Laminate 8/98 TM 2.3.11 Glass Fabric Construction 4/73 TM 2.3.13A Determination of Acid Value of Liguid Solder